By Bob Wettermann
When working on the repair area in the electronics field the need to be able to replace a balled CSP, WLP or BGA can come up in the repair process. That being said when these devices are removed from a PCB the steps that follow require the use of either a new component or in some cases the removed device needs to be new balls attached to the package. In these instances when a device needs to be reballed and then replaced on the board. Furthermore, when a prototype PCB is being assembled and a design being tested a device may need to be reballed. In both of these scenarios, due to the thousands of different ball patterns out on the marketplace a Universal BGA Reballing kit will be the product you will need to reball and then replace the package.
When working on the repair area in the electronics field the need to be able to replace a balled CSP, WLP or BGA can come up in the repair process. That being said when these devices are removed from a PCB the steps that follow require the use of either a new component or in some cases the removed device needs to be new balls attached to the package. In these instances when a device needs to be reballed and then replaced on the board. Furthermore, when a prototype PCB is being assembled and a design being tested a device may need to be reballed. In both of these scenarios, due to the thousands of different ball patterns out on the marketplace a Universal BGA Reballing kit will be the product you will need to reball and then replace the package.
The Universal BGA Reballing Kit is designed for when a device requires reballing and either because of time or because of lack of further detailed mechanical darta pof the part pattern. These kits are designed to reball a component as an all in one swiss army knife with respect to reballing. The kit consists of larger footprint single pitch sizes for reballing 98 per cent of patterns in the market. Typically the full array reballing preform patterns come in both tin-lead as well as SAC lead-free alloy versions. The patterns available in such kits should include full array patterns from 1.27mm down to 0.5mm pitch patterns.
In order to make the modifications to these full array patterns the technician needs to have few other tools available for the job at hand. These tools include a sharp knife, a straight edge and some Kapton™ tape. The knife can be used to cut the preform down to size once the part has been used as a template to cut it to the right outline shape and size. In addition the knife can be used to dislodge balls to make the preform correspond to the pattern on the device. The tape can be used to shield off different parts of the preform from the package to make sure that the balls only are applied to areas where necessary.
In order to make the modifications to these full array patterns the technician needs to have few other tools available for the job at hand. These tools include a sharp knife, a straight edge and some Kapton™ tape. The knife can be used to cut the preform down to size once the part has been used as a template to cut it to the right outline shape and size. In addition the knife can be used to dislodge balls to make the preform correspond to the pattern on the device. The tape can be used to shield off different parts of the preform from the package to make sure that the balls only are applied to areas where necessary.